Laser Radiance Process addresses cleaning issues for future chip generations

Radiance Services Company announced today that Applied Materials, Inc., Santa Clara, California, has obtained a nonexclusive license of the international patent portfolio for the Radiance Process, which uses lasers and flowing gas to remove microcontamination and defects from a wafer without surface melting or ablation.

Since the Radiance Process is dry and uses no water or toxic chemicals, benefits of the technology may include a reduced need for deionized water, chemical handlers, and waste treatment systems in semiconductor facilities.

"We are very pleased that Applied Materials, a recognized leader in providing leading-edge technology to the semiconductor industry, has decided to license the Radiance Process," said Donna Bethell, president and CEO of Radiance Services.

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